臺灣綠色能源技術指出，第二季度末，硅錠產量的增加能滿足600兆瓦的產能，第四季度末會增加到1GW。第二季度末，硅片產量將會增加滿足500兆瓦的產能，公司的下一步擴產產能還在計劃階段。硅片產能已經從之前二月份的300兆瓦發展到了四月份的360兆瓦。

關于臺灣綠色能源技術的晶圓切片產量，該公司最近表示，在2010年上半年，投資者說它已經達到了45MW的容量，并將符合超大規模特的組件（應用材料公司SunFab）模塊，包括光伏建筑一體化應用而設計的半透明模塊。

In the second revision to its ingot and wafer capacity ramps in just a month, Taiwan-based Green Energy Technology (GET) said it is planning to increase ingot production to 1GW by the end of the year. The wafer producer noted that the expansions were to keep pace with tier-one customers’ expansion requests. GET has been at full capacity utilization despite capacity increases for three consecutive quarters.

GET said that ingot growing capacity is set to reach 600MW by the end of the second quarter and then increased to 1GW。 by end of the fourth quarter. Wafer slicing would increase to 500MW by the end of the second quarter, with further capacity expansions in the planning stage. Wafer-slicing capacity had previously been ramped from 300MW in February, to 360MW in April.

In regards to GET’s a-Si thin-film capacity, the company had recently noted in investor presentations that it had reached a nameplate capacity of 45MW and would be qualifying its super-sized (Applied Materials SunFab) modules in the first half of 2010, including semitransparent modules designed for BIPV applications.